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We successfully fabricated an eco-friendly Cu-Zn wetting layer for Sn-Ag-Cu (SAC) solders by electroplating in a cyanide-free solution. The reliabilities of solder joints formed on the Cu-Zn solder wetting layer were evaluated through the drop impact test and thermal cycling (T/C) test. First, boardlevel drop impact test was performed with the SAC solder joints formed on electroplated Cu or Cu-Zn...
In this study, the interfacial reaction between Sn-3.0Ag-0.5Cu solder on Cu-35wt%Zn, Cu-20wt%Zn-15wt%Ni and Cu-25wt%Zn-10wt%Ni substrates were studied after reflow at 250°C for 90s and isothermal aging at 150°C for 50, 100, 250, and 500h. Addition of Zn or Ni into Cu wetting layer was effective to suppress the excessive growth of IMC and avoid the microvoids formation after thermal aging. In the initial...
The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and its effect on the drop impact reliability have been studied. The drop test specimens were fabricated by connecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged at 150degC up to 500 hrs. The well known bi-layer...
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