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During etching treatments of printed circuit board (PCB) with ammnioa solution, galvanic corrosion occurs between electrically connected gold and copper, and resulting in unexpected over-etching problems. Herein, we determine corrosion of galvanic coupled Cu to Au quantitatively in ammonia solutions, and evaluate factors influencing corrosion of galvanic coupled Cu to Au (i.e., area ratio of anode...
In this paper, the scaling effect on copper TSV stress and reliability is investigated, focusing on the correlation of microstructure with plasticity and extrusion for 10, 5, and 2µm diameter vias, fabricated by the via middle process. X-ray microdiffraction revealed local plasticity in the tops of the vias for all sizes, and showed that this seemed to depend on the variations in the grain structure...
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