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A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the reactive system. The results show that the bonding layer is composed of Ni3Sn4 and residual fine Ni particles with a small amount of Ni3Sn2 at 340°C for 240 min,...
The use of refractory castables as a material for lining of runners of blast furnaces is considered. Ultra low cement and non cement castables are developed in conformance with modern technological requirements and environmental standards. The influence of alphabond300 additions on the performance of an ULC tab-corundum castables in the Al2O3-SiC-C system was studied. The behaviors of various alphabond300...
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