Search results for: Seung-Boo Jung
Microelectronic Engineering > 2011 > 88 > 5 > 709-714
Journal of Alloys and Compounds > 2010 > 506 > 1 > 331-337
Microelectronic Engineering > 2010 > 87 > 3 > 517-521
Ieee transactions on components and packaging technologies > 2010 > 33 > 1 > 64 - 70
Journal of Alloys and Compounds > 2009 > 486 > 1-2 > 142-147
Journal of Alloys and Compounds > 2008 > 458 > 1-2 > 253-260
Materials Science & Engineering A > 2008 > 483-484 > Complete > 731-734
Materials Science & Engineering A > 2008 > 483-484 > Complete > 620-624
Materials Science & Engineering A > 2008 > 473 > 1-2 > 119-125
Journal of Alloys and Compounds > 2008 > 448 > 1-2 > 177-184
Journal of Electronic Materials > 2008 > 37 > 1 > 118-124
Microelectronic Engineering > 2007 > 84 > 11 > 2640-2645
Microelectronic Engineering > 2007 > 84 > 11 > 2686-2690
Microelectronic Engineering > 2007 > 84 > 11 > 2634-2639
Microelectronic Engineering > 2007 > 84 > 11 > 2552-2557
Journal of Alloys and Compounds > 2007 > 439 > 1-2 > 91-96
Materials Science & Engineering A > 2007 > 452-453 > Complete > 46-54
Microelectronic Engineering > 2006 > 83 > 11-12 > 2329-2334
Journal of Alloys and Compounds > 2006 > 415 > 1-2 > 56-61
Surface and Coatings Technology > 2006 > 200 > 14-15 > 4440-4447