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Deep trench structures have been widely introduced to the IC and MEMS devices, such as bottle trench structures with an aspect-ratio of more than 50:1 has been adopted to form the capacitors on DRAM. The fabrication of this kind of structures challenges the traditional surface profile and shallow trench measurement technology. A polarized Fourier-transform infrared (FTIR) reflectance spectrometry...
This paper describes a new method to improve adhesion between high-aspect-ratio carbon micro/nano-structure and silicon substrate by micromechanical interlocking over conventional carbon micro-elecro-mechanical system (C-MEMS) process. Anisotropic wet chemical etching using potassium hydroxide (KOH) solution and aqueous tetramethyl ammonium hydroxide (TMAH) is applied to form various aspect-ratio...
Stroboscopic interferometer system is a kind of excellent measurement system for MEMS characterization which can measure the motion of whole MEMS structure in the vision filed, and the dynamic properties such as eigenfrequency and vibration modal shape can be obtained. This paper presents a data analysis method for MEMS dynamic characterization based on stroboscopic interferometer system, which establishes...
Testing of microstructure dynamics is necessary to develop reliable and marketable microelectromechanical systems (MEMS) products. A measurement system for three-dimensional motions and dynamics characterization of MEMS is presented in this paper. The system integrates phase shifting interferometry, microvision, stroboscopic illumination, and base excitation, thus is able to measure the surface shapes...
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