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Sn-Ag-Cu (SAC) solder is one of the most promising candidates to replace Sn-Pb (SnPb) solder alloys. Reducing the amount of Ag phase is an important approach to obtain new SAC solders with lower cost. In this article, different proportions of Bi element were added into Sn-1.0Ag-0.5Cu (SAC105) lead-free solders. The melting points of these alloys are examined and the corresponding tensile properties...
The corrosion process of Zn-30Sn high-temperature solder alloy was investigated in neutral 0.5 M NaCl solution at room temperature (25 ± 0.5 °C) by Scanning Electron Microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The surface observation by SEM indicates that the surface morphology of Zn-30Sn evolves from the dense particle structure to porous structure, and finally converts to platelet-like...
In this paper, we describe a novel mechanism of Ag microflakes sintering which is not yet reported. It involves the generation of Ag amorphous layer, the nucleation and recrystallization of Ag nano particles and dynamic replication of the above-mentioned steps. Transmission electron microscopy (TEM) is utilized to characterize the Ag microflakes sinter joining, which reveals sintering is under the...
The oxidation behavior of Sn–9Zn and Sn–8Zn–xBi (x=1, 3, 6) solders under high-temperature and high-humidity conditions has been investigated as a function of exposure time. The evolution of surface and cross-sectional microstructures during exposure has been examined, and an oxidation model for the Sn–Zn alloys was proposed. The poor oxidation resistance of Sn–Zn alloys is attributed to the oxidation...
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