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In this work we reported ET (electrical testing) failure case studies related to the process drift of barrier metal deposition (BM) during W via/CA process loops. We presented detailed TEM failure analysis in order to understand the failure mechanism and root cause behind the high via/CA resistance. We demonstrated the importance of TEM characterization and identification of key physical failure signatures...
In this work we reported a case study onET(electrical testing) failure with via high resistance issue. In order to understand the failure mechanism and rootcause behind the high via resistance, detailed TEM(transmission electron microscope) analysis wasperformed by using various TEM FA (failure analysis)techniques, including EDX, EELS analysis. It was foundout that high via resistance arose from the...
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