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With the rapid increase in the number of integrated circuits I/O, the traditional wire bonding package has been unable to meet the high I/O number of interconnection needs, flip-chip process can undoubtedly solve the high I/O number of miniaturization package problems, especially flip-chip plastic package can fundamentally meet the increasing number of pins, improve speed and high frequency performance,...
Plastic package of integrated circuit has the advantages of excellent performance, light weight, small size, and outstanding mechanical properties, which can be widely applied to weapons and equipments, aerospace, and other important areas. Due to the thermal mismatch of CTE, the traditional substrate-type plastic package is more likely to have a series of failures such as delamination and warping...
The effect of Ga addition on the microstructure, mechanical properties and weldability of Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder was investigated in this research. It shows that Ga addition has positive impact on refining the microstructure and improving wettability of SAC0307. When Ga addition in SAC0307 accounts for 0.6 wt%, the solder has smaller grain size, more uniform distribution of intermetallic...
Surface mount technology solder joint reliability issue is the impact on the performance of surface mount components and the service life of the key problems, the main factors which influence the reliability of including the internal quality of welds, mechanical properties and loading conditions of solder joints. This paper mainly focused on the pins' failure of Ceramic Small Out-Line Package (CSOP)...
This paper addresses one of the most advanced technologies that meet the demand for the miniaturization of modules and devices with increased performance. In this paper, the glass-based inductor whose Q factor is up to 60 can be prepared by picking glass as the substrate and using the trough glass via technology to form the three-dimensional glass inductor to reduce MOS parasitic capacitor losses...
In this paper, for a silicon-based fan-out package, through the method of finite element simulation, simulated the distribution of residual stress of the passivation layer after curing process, and analyzed the influence of the change of filling rate and the chip thickness to the passivation layer stress. The simulation results show that the maximum stress distribution on the passivation layer fill...
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