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This paper describes design features of the high-performance CPU from a heterogeneous tri-cluster, deca-core CPU subsystem incorporated into the Helio X20 mobile SoC for smartphone applications. The SoC is fabricated in a 20nm high-κ metal-gate CMOS, and has a die size of 100mm2. Additional key features of the SoC include: a graphics processor unit, multimedia (including 32MPixel/24fps camera support),...
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