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In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of Line (BEOL) for the experimental thermal characterization of the inter-die thermal resistance of wafer-pairs fabricated by hybrid Cu/dielectric wafer-to-wafer bonding. The thermal test structures include heater elements and temperature sensors. The measurement data is combined...
The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high performance or consumer markets systems, 3D offers a myriad of opportunities. We will review the different opportunities, indicate process availability and remaining challenges from both design and technology perspective.
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