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In this paper we propose an innovative 3D IC architecture that combines reconfigurable 2D structure with monolithic 3D. This new architecture not only resolves Power Distributive Network (PDN) design and thermal management issues of traditional 3D-IC, but also provides additional power control and programmable routing capability. It provides a cost effective way to integrate different modules together...
This brief discusses an oscillator-based capacitive 3-D touch-sensing circuit for mobile devices. The proposed 3-D touch sensor uses correlated double sampling to achieve a high sensing resolution in the Z-direction and employs bootstrapping circuitry to reduce the mobile screen's interchannel-coupling effects. Additionally, to reduce chip area and assembly, the sensing oscillator is implemented with...
Three-dimensional integration is an emerging and promising architecture for system-level integration towards higher performance, smaller form factor, lower cost and more functionality. In this paper, a novel low temperature Cu nanorod/Sn/Cu nanorod solid-state-diffusion bonding approach for 3D integration was proposed and investigated. Cu nanorods were deposited on the electroplated Cu surface by...
Touchscreen technology plays an important role in the booming mobile devices market. Traditional touchscreen only provides 2D interactions with limited user experience. To overcome these limitations, we propose a novel 3D touch sensing system called the Airtouch system, which can recognize the movement of the finger in a 3-dimensional space. Half of the manufacturing cost is reduced by applying only...
Contactless (3D) touch sensors, when integrated with displays, offer many advantages over that of conventional touch-panel screens by offering a more hygienic and a more immersive & interactive human/machine interface for 3D user experiences [1]. While significant progress has been made in developing 3D contactless touch sensors for larger television and monitor type displays [2-3], the technology...
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