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In this work there have been studied the processes of co-deposition and layer-by-layer electrochemical deposition of tin-silver alloys of the given composition with near-eutectic and peritectic content of components. To predict the thermal stability of electrochemical deposition of binary systems there have been conducted the thermal research in characteristics of the electrolytic alloys obtained...
Physicochemical aspects of the electrochemical formation of vertical contact structures of the Sn–Ag peritectic composition for chipping integrated microcircuits by the inverted crystal method are considered. The layer-by-layer deposition of metals is investigated and the conditions of the vertical growth of the structures are determined.
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