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In this paper, we propose a novel approach to on-chip cooling by thermionic emission by using vertical superlattices fabricated directly into the silicon wafer as opposed to conventional planar additive deposition methods used by most other groups. The advantages of this method are (i) significantly lower fabrication costs and (ii) adequate number of superlattice layers translating to higher efficiency...
In this paper, we propose a novel approach to on-chip cooling by thermionic emission by using vertical superlattices fabricated directly into the silicon wafer as opposed to conventional planar additive deposition methods used by most other groups. The advantages of this method are (i) significantly lower fabrication costs and (ii) adequate number of superlattice layers translating to higher efficiency...
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