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Wire bonding as well as wafer probing can lead to oxide layer cracking in Backend of Line (BEOL) Bond Pad Stacks. This, along with metal migration into formed cracks, may lead to electrical failures. Mechanical loading conditions comparable to those during the wafer test and the wire bonding process can be achieved using a nanoindenter. This work addresses the finite element (FE) simulation of an...
We have presented an advanced FEM simulation model that is able to map the scenario of indentation of a diamond tip into a thin brittle SiNx:H film deposited on a Si substrate. Our 2D axisymmetric and 3D quarter and half models are able to reproduce all failure modes observed in preceding indentation experiments. On the one hand, brittle fracture in both film and surface were successfully modelled...
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