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This paper is concerned with the thermal models which can physically reflect the heat-flow paths in a lightweight three-phase half-bridge two-level SiC power module with six MOSFETs and can be used for coupled electrothermal simulation. The finite-element (FE) model was first evaluated and calibrated to provide the raw data for establishing the physical resistor–capacitor (RC) network model. It was...
3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is presented.
This paper presents an investigation into the integration of high current density inductors into a double side cooled sandwich power module package from the perspective of thermal management of the integrated inductors. The advantage of using this integration method with regards to using the converter thermal management system will be discussed in order to create a high speed optimised commutation...
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