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In this paper, a novel thermal management method of vapor chamber printed circuit board coupled with sunflower heat sink is presented. The finite element method thermal analysis module of a 110 W multi-chip GaN-based white LED lamp is developed by ANSYS parametric design language and user interface design language, the thermal performance of the LED lamp thus can be analyzed more quickly and efficiently...
Light emitting diode (LED) as the new light source has the advantages of power saving, environment-friendly, long lifetime and no pollution compared with fluorescent and incandescent lights. But the disadvantage of LED is low light lumen that only 10%~20% input power transform into the light, and 80%~90% into the heat. The junction temperature of LED is so high as to induce the lifetime declining...
At present, over 95% of the manufactured packages are still being wire-bonded. Due to the ongoing trend of miniaturization, material changes, and cost reduction, wire-bond-related failures are becoming increasingly important. Different finite-element (FE) techniques are explored for their ability to describe the thermomechanical behavior of the wire embedded in the electronic package. The developed...
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