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Since recent years, the micro-electronic industry changes the material usage, design and structure, in order to satisfy the customer demands of the higher performance and smaller size. One of the examples is the change of the basic materials from Al/SiO2 to Cu/low-k in IC interconnect structure. As a consequence, new reliability issues at device/product level have been discovered, and most of the...
Low-Ag solder SnAgCu (SAC) is more suitable for improving the shock performance of solder joints as reported by many papers. However the properties of low-Ag solder, with different Cu contents, under service conditions are lacking. The forming mechanism of the intermetallic compound (IMC) and the relation with the joint strength need to be investigated. In this study, the effects of high-temperature...
Wire pull tests are generally conducted to assess the wire bonding quality. Using Cu/low-k technology, two failure modes are usually observed: Failure in the neck of the wire (neck break) and metal peel off (MPO). The objective of our study is to investigate the root cause of metal peel off by using a combined experimental and numerical approach. First, dedicated failure analyses are conducted to...
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