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In this study, the brittle fracture of intermetallic compound (IMC) between low-Ag SnAgCu (SAC) solder and under bump metallization (UBM) under high-speed pull condition is studied for wafer-level chip-scale packages (WLCSP). The fracture morphology and fracture mechanism of IMC are analyzed by SEM, EDX and deeply etching techniques. Also, the forming mechanism of IMC and the relation with joint strength...
To enhance the ability of lead-free solder joint to resist failures induced by mechanical impact and shock, some researchers have introduced low-Ag lead-free solder. In this study, the formation and evolution of IMC, the fracture morphology and performance of solder joint between SAC 105 solder and Under Bump Metallization (UBM) have been studied after different temperature storage aging and multi-reflow...
Low-Ag solder SnAgCu (SAC) is more suitable for improving the shock performance of solder joints as reported by many papers. However the properties of low-Ag solder, with different Cu contents, under service conditions are lacking. The forming mechanism of the intermetallic compound (IMC) and the relation with the joint strength need to be investigated. In this study, the effects of high-temperature...
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