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With the increased use of mobile phones, navigation systems, PDA's, laptop's and portable gaming devices the drop reliability of microelectronics has become an important parameter. Assessing the solder interconnect quality by means of drop impact testing, as standardized by e.g. JEDEC, during normal production requires considerable amounts of time and effort. Besides this, the repeatability of the...
A correlation between the drop impact test and cold bump pull test is investigated. This can be divided into three parts. First by investigating the cold bump pull test apparatus for uncontrolled parameters that might introduce a bias or spread in the results. Secondly by means of modeling the cold bump pull test to investigate solder bump deformation and solder bump loading during pull off. Finally...
A common failure during the lifetime of most mobile devices is failure through dropping. This is nowadays tested by means of the drop impact test, which has been standardized by JEDEC. This method however takes quite some time and has some problems regarding reproducibility. This paper reports the work done on correlating the drop impact test with the cold bump pull that might be a replacement. The...
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