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This paper provides a nano-scale simulation model to study the UV nanoimprint lithography. Simulation of molecular dynamic is used to calculate the interfacial stress between the mold and pattern-transfer-polymer layer. Energy minimization was performed to find the equilibrium molecule configuration of the material system using the ensemble of the constant number of particles, constant-volume and...
Nanoimprint lithography (NIL) provides a low cost process for nano-pattern mass production. Polymer filling and de-molding processes determine the quality of the imprinted pattern in NIL. In UV-nanoimprint lithography, low viscous polymer reduces the requirement of imprint pressure in polymer filling. The interaction between pre-patterned mold and UV-curable polymer during de-molding greatly affect...
This paper reports on adhesion enhancement effects of self-assembled organothiol treatment on copper/epoxy interface, as well as a significant reduction in treatment time by the electrochemical assembly approach. Interfacial adhesion strength between copper/epoxy interfaces was studied against different treatment time under the influence of electrical potential. A maximum 20-fold enhancement was demonstrated...
Cu/Epoxy is known as one of the weakest joint in the electronic packages. Due to the lack of adhesion, the copper and epoxy encapsulant interface is prone to delaminate, and failure will happen in electronic devices. To solve this problem, the thiol-based self-assembled molecular (SAM) treatment is introduced by our group. The benzene ring will give the hydrophobic characteristic to the surface up...
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning in plastic-encapsulated IC packages is a defect frequently occurring during the solder reflow due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of the encapsulated package. To obtain good...
This paper focuses on the use of new hydrophobic thiol based molecular as adhesion promoter for copper-epoxy interfacial adhesion improvement. The motivation of this study is the long term interfacial adhesion reliability under moisture environment. In order to solve this problem, our group introduced the use of thiol-based molecules (SAM P) having hydrophobic characteristic as adhesion promoter through...
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