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We developed a new chip-to-wafer 3D integration technology using self-assembly and electrostatic (SAE) bonding. High-throughput multichip self-assembly with a high alignment accuracy within 1 μm was achieved by the SAE bonding technique. Self-assembled known good dies (KGDs) were temporarily bonded on SAE carriers by electrostatic bonding force. We implemented multichip transfer processes twice and...
We proposed a new chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding. In the hybrid self-assembly-based chip-to-wafer 3D integration (HSA-CtW), liquid surface-tension-driven chip self-assembly is combined with high-speed robotic pick-and-place chip assembly and electrostatic multichip temporary bonding. Hybrid self-assembly can realize high-throughput...
Two key technologies consisting of chip-to-wafer bonding through a non-conductive film (NCF) and wafer-level packaging using compression molding were studied for self-assembly-based 3D integration, especially reconfigured wafer-to-wafer stacking. 4-mm-by-5-mm chips having 20-μm-pitch Cu-SnAg microbumps were successfully bonded to wafers through NCF. The resulting daisy chain obtained from the chip-to-wafer...
The aim of this article is to develop a robust real velocity sensing system for agrimotors such as sprayers and harvesters of which large slip in the fields is unavoidable. Shifting displacement on ground is measured indirectly by using image matching, instead of conventional tachometer measuring method. In so doing, robust sensing system which eliminates the influences of such as bad weather and...
Chip-to-wafer bonding is a promising technology for 3D integration due to high production yield using known good dies (KGDs). However, conventional chip-to-wafer 3D integration lowers production throughput because pick-and-place chip assembly is employed. To overcome the problem, we proposed a new chip-to-wafer 3D integration using self-assembly by which many KGDs can be simultaneously, rapidly, and...
We have introduced a new 3D stacking technology called reconfigured wafer-to-wafer 3D integration using surface tension-powered multichip self-assembly and multichip transfer techniques. Many Si chips were simultaneously self-assembled to a carrier wafer named “reconfigured wafer”. High-precision chip alignment with sub-micron-scale accuracy can be realized by optimizing self-assembly conditions....
In medical imaging research fields, three-dimensional (3D) shape modeling and analysis of anatomic structures with fewer parameters is one of important issues, which can be used for computer assisted diagnosis, surgery simulation, visualization and many medical applications. The 3-D object shape or surface can be expressed by spherical harmonics. In this paper, we present a spherical harmonics based...
We demonstrate two types of three-dimensional (3D) integration using chip self-assembly techniques with liquid surface tension. In reconfigured wafer-to-wafer 3D integration, many different sizes of chips having In/Au microbumps with/without TSV (through-silicon via) were temporarily placed by self-assembly on a reconfigured wafer in a back-to-face manner. The many chips can be then simultaneously...
We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas...
The method for measuring a motorcycle trajectory using GPS is needed to make a simulation of motorcycle dynamics. In GPS measurement of a motorcycle, both declination of the body and obstacles near the course exert a bad influence. Therefore, we propose a new algorithm for GPS measurement of a motorcycle trajectory. We interpolate the missing observation data within a few seconds using curve of the...
GPS (Global Positioning System) is a 3-D positioning system and its positioning accuracy is about 10m under ideal condition. For two-wheeled vehicle, high accuracy positioning is difficult because of the inclination of the body when receiving signal causes loss of the signal from the satellites. In the result, positioning accuracy gets worse or positioning itself cannot be carried out. This study...
GPS (Global positioning System) is a 3D positioning system using space satellites. Recently, the use of GPS in the city as the navigation system is rising continuously. However the measurement error is large when the receiver is used near the buildings such as in urban canyon. This reason is that the receiver is not able to measure a pseudo range accurately because of receiving reflected wave (multipath)...
We have newly proposed heterogeneous multi-chip module integration technologies in which MEMS and LSI chips are mounted on Si or flexible substrates using a self-assembly method. A large numbers of chips were precisely and simultaneously self-assembled and bonded onto the substrates with high alignment accuracy of approximately 400 nm. Thick MEMS and LSI chips with a thickness of more than 100 mum...
We proposed a new three-dimensional (3-D) super-chip integration technology using self-assembly technique. Many chips are simultaneously aligned and bonded onto lower chips using a self-assembly technique in a super-chip integration. It was confirmed that Si chips with sizes of 1 mm square to 5 mm square were precisely assembled on Si wafers with high alignment accuracy of less than 0.5 ??m. We have...
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