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This paper presents the electrical characterization of annular TSV technology for full wafer applications. A possible utilization of this technology is the WaferBoard™, a reconfigurable circuit board for rapid system prototyping. Electrical resistance and capacitance of a single 2-4µm thick annular TSV with a diameter of 110µm and a height of 350µm are measured to be about 10mΩ and 0.27 pF, respectively...
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