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Ni film electroplated between matte tin film and Cu-based lead-frame was used as a diffusion barrier to prevent whisker formation on the tin surface through blocking the formation of Cu6Sn5 intermetallics. The interfacial microstructure of Sn/Ni and Sn/Cu which formed after reflow treatment and the following humidity/thermal testing were characterized by SEM and BSE. The testing results indicated...
Ni film electroplated between matte tin film and Cu-based lead-frame was used as a diffusion barrier to prevent whisker formation on the tin surface through blocking the formation of Cu6Sn5 intermetallics. The interfacial microstructure of Sn/Ni and Sn/Cu which formed after reflow treatment and the following humidity/thermal testing were characterized by SEM and BSE. The testing results indicated...
In this work, matte Sn bilayer with different grain size in each layer were electrodeposited onto IC leads to adjust the internal stress of tin films and thus affect tin whisker growth. Sn/Ni film was also deposited in order to compare with the matte Sn bilayer. Microstructural characterization of Sn bilayer and Sn/Ni film were analyzed through surface and cross-section examination using field emission...
A nickel barrier layer between a matte tin film and a C194 substrate has been used to prevent whisker formation on the tin surface by blocking the formation of intermetallics, which is one of the root causes of whisker growth. However, the introduction of the Ni barrier to the matte Sn/C194 system greatly changes the mechanical properties of the bended leads. In this paper,...
Electroless Sn films have great potential in the lead-free age such as for high-density, fine-pitch, narrow soldering pad and bump interconnection applications. In the present work, electroless Sn were deposited onto lead-frame alloys (C194 and FeNi42). The microstructures of the electroless Sn films and tin whisker growth in thermal / humiditive chamber were investigated with scanning electron microscope...
Electroplating matte Sn has attracted much attention in the lead-free age. To prevent a growth of tin whiskers from lead-frame supported matte tin films, various mitigation methods have been reported. In this work, pure matte Sn was electroplated onto C194 alloy, and electroplating Ni film was used as barrier between matte Sn and lead-frame alloy. The microstructures of the Ni/Sn depositions and tin...
Electroplating Sn plays an important role in the lead-free age because of its excellent solderability and many other advantages. In this work, bright Sn was electroplated onto both C194 and FeNi42 alloys. The plating parameters, substrate effect, barrier layer effect and IMC formation were investigated through detailed microstructural characterization of the Sn films, barrier layers and cross-sections...
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