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In the present work, a close-to-product investigation was conducted in evaluating tin whisker growth on electroplated matte Sn films. The matte Sn films were deposited on Cu leadframes (C194). Electroplating Ni film was used as a barrier between the Sn film and the substrate. The experimental results revealed that Ni barrier could completely restrain the tin whisker growth after 8,000 hours storage...
In this work, we fabricate bright tin films on two kinds of representative lead-frame substrates (C194 and FeNi42). Ni film was electroplated between Sn plating and the alloy substrate as a diffusion barrier. The samples were stored under 55 °C / 85% RH condition for up to 8,000 hours. The effect of alloy substrate, tin film thickness and Ni barrier on the tin whisker growth was investigated for a...
A nickel barrier layer between a matte tin film and a C194 substrate has been used to prevent whisker formation on the tin surface by blocking the formation of intermetallics, which is one of the root causes of whisker growth. However, the introduction of the Ni barrier to the matte Sn/C194 system greatly changes the mechanical properties of the bended leads. In this paper,...
Electroless Sn films have great potential in the lead-free age such as for high-density, fine-pitch, narrow soldering pad and bump interconnection applications. In the present work, electroless Sn were deposited onto lead-frame alloys (C194 and FeNi42). The microstructures of the electroless Sn films and tin whisker growth in thermal / humiditive chamber were investigated with scanning electron microscope...
Electroplating matte Sn has attracted much attention in the lead-free age. To prevent a growth of tin whiskers from lead-frame supported matte tin films, various mitigation methods have been reported. In this work, pure matte Sn was electroplated onto C194 alloy, and electroplating Ni film was used as barrier between matte Sn and lead-frame alloy. The microstructures of the Ni/Sn depositions and tin...
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