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In this letter, low-loss and highly fabrication-tolerant flip-chip bonded vertical couplers under single-mode condition are demonstrated for the integration of a polymer waveguide chip onto the Si3N4/SiO2 passive platform. The passively aligned vertical couplers have a lateral misalignment between polymer and Si3N4 waveguide cores of $\pm 1.25~\mu \text{m}$ . Low-loss operation has been experimentally...
The integration of rare-earth doped double tungstate waveguide amplifiers onto passive technology platforms enables the on-chip amplification of very high bit rate signals. In this work, a methodology for the optimized design of vertical adiabatic couplers between a passive Si3N4 waveguide and the on-chip amplifier is proposed. The methodology shows high efficiency and tolerance in the adiabatic coupler...
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