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The process of singulating IC packages such as Quad Flat Pack No-Lead (QFNs) by either a sawing or punching operation results in exposed copper on the sidewalls. This exposed copper surface can oxidize leading to poor or no solder wetting up the sidewall during the assembly operation. The consequence of this oxidized copper surface is either incomplete or no solder fillet formation during the PCB...
The power of state-of-art LED has been substantially raised for the continuous demand of high lumen output. Limited by the overall efficiency, at least 70% of the total input power would be transformed into heat. As a result, thermal management gained more and more attention. For the sake of reducing the material cost and also further improving the thermal performance, the FR-4 printed circuit board...
As the conversion of the electronics industry to lead free soldering materials continues some unexpected negative side effects of higher lead free reflow temperatures have occurred. Defects such as delamination or "popcorning" in surface mount components have increased significantly since lead free soldering has become mainstream. Popcorning is a defect that manifests itself as a fracture...
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