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Wire bonding to a thin stacked overhang die causes die cracking. It is experimentally confirmed that cracking starts from one of chippings which are derived from dicing process and there exists correlation between chipping size and fracture load. Under the assumption of the weakest link model, the equation of calculating failure probability is derived as the form of the Weibull function. Die fracture...
The idea of the Weibull stress, which is based on the “local approach”, has been applied to delamination failure analyses of semiconductor packages. Interface fracture strengths between package mold resin and 42 alloy lead frame are obtained by a conventional shear test with three resin sizes and two shear heights. Six different facture strengths are converted to a same adhesion strength value which...
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