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The use of recycled polymers in 3D printing technologies has recently become a promising research topic because of the global concerns on plastic waste pollution and an increase in awareness of sustainability and circularity. In order to unlock the potentials of 3D printing beyond prototyping purposes, continuous fiber‐embedded fused filament fabrication (FFF) as a process for composite production...
Along with the flow and the fundamental focus on 3D integration, is the study in enabling stacking as well as assessing the needs to make it comparable to current manufacturing standards. To do this we take a look on key essential elements of a manufacturing line and applying it to the stacking process. Key areas of focus is process stability, control and ability to reducing the bond parameters (time,...
Among the technological developments pushed by the emergence of 3D Stacked IC technologies, wafer thinning has become a key element in device processing over the past years. One major criteria, being Total Thickness Variation after thinning, various aspects in the temporary bonding step will be discussed with this respect. While these elements are now becoming mature enough for high-volume manufacturing,...
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