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This paper focuses on the use of CNTs for new mm-to-THz interconnects for nanopackaging. To successfully integrate CNT to be in line with nanoelectronics trends, new growth processes and modeling approaches are proposed. Several experimental works are presented such as millimeter-wave flip-chip bonding. In addition, novel THz 3-D wireless interconnect, based on CNT monopole antennas, working at 200...
In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other...
We investigate the use of bundled carbon nanotubes (CNTs) as nano-antennas for chip-to-chip and on-chip communications. We model CNTs as hollow tubes with complex surface conductivity. This is implemented in two finite-elements-method 3D electromagnetic solvers. Single-CNT-arms dipoles are simulated to validate our modeling approach by comparing our results to those found in literature. We then extend...
Due to their excellent electronic and thermal properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show for the first time both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: one is based on electromagnetic...
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