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Increases in printed circuit board (PCB) cost is leading to denser routing of high speed signal traces and this, in turn, is increasing the crosstalk among the traces. The crosstalk between the broadside coupled traces in adjacent layers is becoming an important factor to account for as the signal speeds increase. The coupling between parallel broadside coupled traces can be modeled using multi-conductor...
An improved multiple scattering method is developed for an irregular plate pair where via pad/antipad radius is electrically small and the spacing between any two vias is relatively large so that the axially anisotropic parallel plate modes can be neglected. The plate-pair impedance matrix, widely used as an important parameter in power integrity analysis and also a critical part for via coupling...
The physics associated with mutual inductance between vias has been analyzed, and a method has been proposed to calculate the total equivalent inductance including the effect of mutual inductance. The method has been further simplified to an expression in a closed-form. The equations have also been verified and shown to be accurate by measurements.
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