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In the current work, a mixed powder BiAgX solder paste system with the melting temperature above 260°C and comparable, or better, reliability to the high lead-containing solders has been studied. The mixed powder solder paste system is composed of a high-melting first alloy solder powder as a majority and the additive solder powder as a minority. The additive solder is designed to react preferentially...
Although lead free soldering has been the main stream of industry since 2006, with the replacement of eutectic SnPb system by SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature. BiAg alloy exhibits acceptable bulk strength but very poor ductility and wetting, therefore is not acceptable as an option. In current work, a...
Lead free soldering has been the main stream of industry since 2006, with eutectic SnPb system phased out by SnAgCu system. However, development of lead-free alternatives for high melting high lead solder alloys is still struggling, thus hampering the completion of full lead-free conversion. BiAg alloy exhibits acceptable bulk strength but very poor ductility and wetting on copper, therefore is not...
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