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The power distribution network on package generally consists of multiple power domains. It is required for each power domain to deliver a robust and stable voltage, which allows the analysis to be done within each domain structure. Therefore, the power noise transfer from a noisier power domain to the neighboring quieter power domain is seldom considered, while it can lead to the performance failure...
This paper presents a crosstalk model base on even-odd mode analysis. It demonstrates that crosstalk analysis needs to look at the aspect of the timing delay between even and odd mode and the multiple reflections that occurred in a system. This concept is validated further by measurement result.
Power delivery net (PDN) is vital for FPGA and structural ASIC devices packages to deliver power supply with high fidelity from system board to IC chips, which requires low impedance maintained over the entire frequency range of device under operation. Many efforts have been spent to lower PDN impedance, including increased use of on-die, on-package and on-PCB decoupling capacitances. In this study...
This paper presents the dominant contributors of mutual inductance in wire-bond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package...
This paper presents the dominant contributors of mutual inductance in wirebond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package...
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