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In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple estimation formula that can be used for temperature estimation for densely mounted components was derived.
Thermal contact resistance is one of the important parameters for accurate temperature prediction in CFD (Computational Fluid Dynamics) analysis. However, thermal contact resistance is dependent on surface condition of materials, and estimation of thermal contact resistance is difficult. In this study, CFD analysis with various size of small air gap on the contact surface of the material was conducted,...
Recently, a high accuracy soldering method is required. Then, laser soldering has attracted attention. In laser soldering, it is difficult to detect an optimal laser condition depending on production conditions, because the amount of heat transfer from solder through copper wiring is different in circuit boards and soldering positions. Laser condition should be adjusted according to the situation...
The high-density interconnection substrate invariably poses enormous difficulty to thermal design analysts due to complex metal layout patterns embedded in the dielectric matrix. A modeling method is proposed, which produces effective thermal conductivity values for elements of the substrate under a specified boundary condition. A novel parameter, the indexed metal volume fraction, is employed to...
In recent years, thermal design of electrical equipments including printed circuit board (PCB) is a key issue for developing electronics. Computational fluid dynamics (CFD) is widely used method for thermal design of electrical packages. Nowadays, heat generation density in electrical packages is increasing and PCB becomes one of heat dissipating path in electrical packages. However, considering complex...
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