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This paper investigates transient temperature prediction of microprocessor hot spot by utilizing one-dimensional thermal network with average temperature nodes. Different from traditional thermal network, introduced one-dimensional thermal network in this paper consists of not only material thermal resistances and material thermal capacitances but also thermal spreading resistances and a thermal local...
This paper describes experimental study about cooling performance of natural and forced air convection in compact heat sinks for LSI packages. Temperature rise of several heat sinks having different base areas, fin intervals and fin heights was measured. In natural convection case, the effect of supplied power on the temperature rise of the fin was examined. In forced convection case, correlations...
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