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This paper describes the tracking of a vehicle by using a 3-dimensional positioning system, which is composed of two 2-dimensional Infrared (IR) signal source trackers. Once the 2D trackers detect the incident angles of the IR signal source, the 3D positioning system will locate the IR signal source. In the experiments, the detection on the longitudinal direction is concerned, and the IR signal source...
This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly...
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