The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Scaling of semiconductor chips have dramatically helped the increase in functionality of modern electronic and communication devices. However, this scaling also increased I/O count per unit area leading to necessity for smaller bumps and pitch sizes and finer trace pitches in flip chip substrates used in high end ICs. Furthermore, the requirement for lower warpage and change in thermal expansion of...
The demand for high performance build-up electrical insulation materials, used in IC package substrates, is increasing due to ever-increasing speed signal processing and density of LSIs due to requirement for faster information and communication equipment in recent years. These LSIs with signal travelling at high speeds also causes GHz band signal to travel through the package substrate. If the dielectric...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.