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We reported investigation of lattice resolution imaging using a Hitachi SU9000 conventional in-lens type cold field emission scanning electron microscope without an aberration corrector at an accelerating voltage of 30kV and discuss the electron optics and optimization of observation conditions for obtaining lattice resolution. It is possible to visualize lattice spacings that are much smaller than...
We developed a novel through silicon via (TSV) fabrication process using dry filling of sub-micron Au particle for stack type 3D MEMS. X-ray image shows that the slurry including Au particles was uniformly filled into vias with squeegee under low pressure in short time. TSV with a diameter of 30 μm and depth of 70μm were successfully fabricated. The resistance of single TSV was 0.11 Ω. The dielectric...
Low-temperature wafer bonding using sub-μm gold particles together with wafer-level pattern transfer method has been developed. Sub-μm Au particle patterns were successfully transferred at 150°C and wafer bonding was performed at 200°C. Surface compliant performance was demonstrated by compression deformation measurement.
This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded...
In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1×10 −3 mbar. The bonded wafers were diced into 5mm×5mm individual chips. The bond strength of...
Mechanical properties of sintered gold compacts with sub-micron gold powders have been evaluated, and mechanical shear fatigue tests for flip-chip specimens with sintered gold bumps were carried out as a new inner bump material. From tensile-relaxation tests, material properties of gold sintered compacts depend on the sintering temperature (S.T). SEM observations reveal that the microstructures of...
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