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Due to the cost advantage, copper and palladium coated copper (Pd/Cu) wires are replacing gold wires in wire bonding. The Pd coating enhances the shelf storage time and stitch bond quality of Cu wire as it protects Cu from oxidation. For future developments, it is important to understand the effects coating has on the bonding process. One major process mechanism is the plastic deformation of the bonding...
Cu wire bonding is one of the hottest trends in electronic packaging due to the cost and performance advantages of Cu wire over Au wire. However, there are many challenges to Cu wire bonding, one of which is the increased stress transmitted to the bond pad during bonding. This high stress is not desirable as it leads to pad damage or cratering in the Si under the pad. Another issue is pad splash in...
Wire bonding is the most widely used interconnection technology in microelectronics. Aggressive technology scaling has led to device miniaturization resulting in a need for ultra-fine pitch bonding. A deep understanding of the bond formation process will help improve wire bond process reliability and product yield. This paper reports on the study of ball bond (1st bond on the chip) formation process...
Cu wire bonding is one of the hottest trends in electronic packaging due to the cost and the electrical and thermal performance advantages of Cu wire over Au wire. However, there are many challenges to Cu wire bonding, one of which is the increased stress transmitted to the bond pad during ball bonding process. This high stress is not desirable as it leads to pad damage or cratering in the silicon...
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