Search results for: Kyung Wook Paik
Microelectronics Reliability > 2017 > 78 > C > 181-189
Microelectronics Reliability > 2015 > 55 > 2 > 432-441
Microelectronics Reliability > 2012 > 52 > 6 > 1182-1188
Microelectronics Reliability > 2012 > 52 > 6 > 1174-1181
Microelectronics Reliability > 2012 > 52 > 1 > 225-234
Microelectronics Reliability > 2012 > 52 > 1 > 217-224
Thin Solid Films > 2011 > 519 > 11 > 3906-3913
Materials Science & Engineering A > 2010 > 528 > 2 > 698-705
Microelectronics Reliability > 2008 > 48 > 7 > 1052-1061
International Journal of Adhesion and Adhesives > 2007 > 27 > 1 > 77-84
International Journal of Adhesion and Adhesives > 2006 > 26 > 5 > 304-313
Microelectronics Reliability > 2006 > 46 > 2-4 > 589-599
Microelectronics Reliability > 2006 > 46 > 2-4 > 512-522
Materials Science & Engineering B > 2006 > 126 > 1 > 59-65
Materials Science & Engineering A > 2004 > 380 > 1-2 > 231-236
Materials Science & Engineering B > 2004 > 110 > 3 > 233-239
International Journal of Adhesion and Adhesives > 2004 > 24 > 2 > 135-142
Acta Materialia > 2004 > 52 > 1 > 129-136
Sensors & Actuators: A. Physical > 2003 > 105 > 2 > 211-224