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This paper presents a broadband antenna on HR SOI CMOS technology for co-integration with power amplifier (PA) or low noise amplifier (LNA). In a System on Chip (SoC) approach, the co-design of the antenna and Integrated Circuits (ICs) on a same silicon substrate is a convenient solution to suppress lossy matching networks and to reduce the radio front-end cost. The proposed antenna presents a simulated...
This paper presents the design of a packaged antenna including glass substrate. A rectangular patch antenna is implemented on glass substrate exploiting IPD™ technology, and excited by a quarter wavelength slot dipole implemented on BiCMOS B9MW technology (Low Resistivity (LR) Si - ρ = 12 Ω.cm). The described solution solves the interconnection problem between Silicon Integrated Circuits (ICs) and...
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