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Going deep has been the strategy for the sustainable development of the Tahe Oilfield. Following the TS1 well in block 1, which revealed excellent combinations of hydrocarbon generation, migration and accumulation in the deeper parts of the Tarim Basin, the TS2 well was drilled to learn more about the prospectivity in the deeper parts of the main blocks of the Tahe Oilfield. Seventeen core samples...
The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain distribution of the pad is not even and increasing with the time, the largest stress and strain all locate...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain distribution of the pad is not even and increasing with the time, the largest stress and strain all locate...
In the high-speed PCB design, vias has become one key structure of interconnection lines, vias equivalent to a discrete structure of the signal transmission path, lead to signal reflection, attenuation and other signal integrity issues. In this paper, vias model established through 3D electromagnetic analysis software HFSS, the effects of factors of the ground vias around signal vias such as size,...
The paper proposes a method that realized the solder joints assembly quality fault diagnosis. After an analysis of fuzzy fault diagnosis principle of SMT products, geometrical shape parameters which reflected PQFP solder joint quality were studied. Reasonable shape of components solder joint was built based on minimal energy principle. Then through the study of the real solder shape, the graphic token...
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