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This study is focused on the correlation between warpage of ball grid array (BGA) components and the yield of package-on-package (PoP) assembly on printed circuit board (PCB). Gap analysis and modeling have been employed to address the solder joint "open" defects. Warpage measurements for BGAs were performed under simulated reflow conditions. A yield prediction model is proposed based on...
Traditionally, most of the miniaturization for Printed Circuit Board Assemblies (PCBA) has been accomplished by stacking bare dice inside the package, reducing the pitch of the package, and/or reducing the component and pad spacing on the Printed Circuit Board (PCB). There is a limit, however, on what can be done with regards to component pitch and spacing. Package on Package stacking (PoP) offers...
Conductive adhesives have been widely used in die mounting and component terminal bonding in certain types of hybrid circuits for a number of years. ECA (Electrically conductive adhesive) is an alternative to lead-free solder for certain specific applications in electronic products. Low processing temperature, fine pitch, flexible process steps, and no flux residues are some of the major advantages...
Pad cratering is one of the most important issues in lead- free soldering. The PCB materials change and the increased reflow temperature account for the degradation of the drop test performance of the PCB materials. This paper uses both finite element analysis (FEA) and experimental testing to study PCB pad lift and adhesion. The pad lift force in pull and shear tests has been determined with the...
This analysis provides a cost justification for low and mid range priced placement equipment. The main focus of the analysis is on the equipment idle time which exists because of transfer-time for low-component-count applications and setup-time for high-mix applications.
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