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The measurements of junction temperature rise and thermal resistance of power LEDs by junction characteristic are proposed in this paper. The measured thermal resistance is corrected by the light-absorbing method. It is also proved that the physical meaning of the electrical average temperature rise of series LED array system is the arithmetic mean of the temperature rise of all sub-LEDs in the system...
It's proved that the physical meaning of the electrical average temperature rise of series LED array system tested by electrical temperature sensitive parameter (TSP) method is the arithmetic mean of the temperature rises of all sub-LEDs in the system. Based on this relationship, a novel method to evaluate the temperature distribution of series LED systems by scan measurement and recursive calculation...
The thermal analysis of ICs has been studied in different methods for years. In this paper, a new method to analyze the steady-state temperature distribution of integrated circuit is presented. According to equivalent thermal resistance formula obtaining by an aid tool ANSYS and programming idea, the temperature distribution graph of an analog integrated circuit is obtained. And the result is verified...
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