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This paper discusses the problem of nonlinear effects occurring in thermal modelling of electronic systems. In particular, the influence of heat transfer coefficient temperature dependence is studied based on a practical example of free convection cooled power device. The nonlinearity is identified by comparing the recorded heating and cooling curves. Additionally, the analyses are supported also...
3D stacking of microprocessors is an idea that promises to continue the accomplishment of high performance processors while allowing the increment of transistors density inside a given area. However, 3D stacking inevitably increases the power density and, therefore, thermal issues related to this idea must be overcome first in order to make use of all the advantages of 3D processors. In literature,...
This paper shows the thermal analyses of the latest 12 nm FinFET transistors. The simulated structure was based on the chips developed and applied in modern devices designed in Samsung 14 nm Samsung Low Power Early technology. The structure, which is taken into consideration, is the fourfold FinFET transistor including its ambient. In order to simplification of the analysis, the assumption related...
The production of stereoscopic motion pictures has been recently getting increasingly popular. To provide the best quality of the resulting image, the parameters controlled must precisely correspond to the values calculated by the stereoscopic image analysis platform or chosen by a camera operator. Currently no integrated system exists, which can provide remote monitoring and control of the parameters...
The paper presents a FPGA-based dedicated system for rapid calibration of 3D camera rigs. The developed device aims to help during camera set-up, by allowing the operator to easily compare the images from two cameras with use of several composition methods. The paper indicates the challenges related to development of high-throughput video processing systems in FPGA circuits. The processing methods...
3D stacking of integrated circuits is a promising idea for increasing the processor performance. However, the major challenge is overcoming thermal issues due to excessive power density. In this paper, using Intel's Haswell processor as an example, we analyze the thermal behavior of an eight-core processor implemented as a 2D chip and as a 3D architecture with two layers. We also investigate the use...
The last few years in the movie industry were marked by continuous growth in the popularity of 3D technology. 3D movies are nowadays a major draw for both cinema and TV audiences. The application of 3D technology in combination with modern ultra high-definition video cameras causes that today's movies are more impressive and realistic. However, it also makes their production more and more complex,...
The article presents the theme of stereoscopic images quality assessment. The first part of the paper describes the definition of stereoscopy and provides a preliminary discussion of the issue. The second part of the paper lists a set of commonly used metrics for the evaluation of 3D image divided into subjective and objective metrics, and these in turn, based on the analogical 2D metrics and metrics...
Cubic boron nitride is commonly used as a cutting tools material for the sake of its high hardness and wear-resistance. Pulse Plasma Sintering was proposed to decrease the production costs. This method is very attractive for industry, because it significantly decreases the costs of production. The goal of this paper is to present the control system prototype for Pulse Plasma Sintering processes based...
Data acquisition systems must be capable to process all the data produced by the source to ensure the highest level of accuracy, especially when it deals with hard real-time system monitoring. However, the production of data is faster than the process to acquire and to process such a data. Using concurrency approach is an alternative to obtain the required level of performance and data processing...
Electro-thermal models are commonly used in simulations and designing MEMS devices, also in case of microbolometers. These models allow to estimate sensors performance before fabrication that consequently impacts on fabrication cost. Coupling of electric and thermal domains and building appropriate model for carrying out simulations are crucial to detect all phenomena having impact for Readout Integrated...
Flexible capacitors were made using stainless steel yarns as yarn electrodes on textile substrate. The electrolyte material used was a dispersion of polyethylene dioxythiophene (PEDOT) : polystyrene sulphonate (PSS). After charging the capacitor for sufficient time, a sharp voltage drop was observed initially for a few seconds, then the voltage discharge slows down. It was not easy to establish the...
The objective of this paper it to present a work concerning a proposed design and development of an analog Pulse Width Modulation (PWM) Application Specific Integrated Circuit (ASIC) with built-in analogue control loop and PWM for DC/DC power converters used in space applications. The described circuit can be used in avionics, aerospace devices and vehicles. The paper presents the general requirements...
This paper presents the Finite Difference Method solution of Dual-Phase-Lag heat transfer model appropriate for a thin one-dimensional problems with a heat flux heating on the one side and a fixed reference temperature on the other side. The simulation results are shortly compared with Fourier-Kirchhoff heat equation model.
The recent introduction of advanced hardware architectures such as the Micro Telecommunications Computing Architecture (MTCA) caused a change in the approach to implementation of control schemes in many fields. The development has been moving away from traditional programming languages (), to hardware description languages (VHDL, Verilog), which are used in FPGA development. With...
This paper presents the first approach to application of the two-dimensional image processing in recognition of brain amyloidosis diseases. The authors propose to create special universal amyloid plaque computer pattern and special multivariate medical image segmentation techniques based on collected images and statistical information. The recognition image procedure is divided into 3-dimensional...
This paper discusses on the practical example of a power diode the problem of the heat transfer coefficient dependence on temperature and its impact on device junction temperature when the thermal resistance is dominated by the heat exchange with ambient, e.g. for the free convection cooling. The proper determination of this dependence is crucial for the accurate computation of the device operating...
This paper presents the Green's function solution of the dual-phase-lag heat equation. The solution is derived for a thin one-dimensional slab heated on one side by a heat flux and cooled on the other side by the imposed isothermal boundary condition. The simulation results are compared with the ones obtained previously for the Fourier-Kirchhoff heat equation.
The success of electric vehicle drives heavily depends on the maximization of energy conversion efficiency. Losses in power electronic converters increase system size, weight and cost, raise energy demand and limit the operating distance range. Advances in semiconductor technology can remedy these problems and silicon carbide devices are of special interest in this context. This material enables manufacturing...
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