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Thermal simulations of electronic systems usually are carried out employing linear models whose element values do not depend on temperature. The hypothesis on system linearity can be verified in practice by the summation of measured heating and cooling curves. When a considered problem is linear, at all time instants the curves always add up to the straight line corresponding to the steady state temperature...
This paper discusses the problem of using compact thermal models for analysis of packages containing multiple devices. In such cases, the devices influence each other hence in order to predict accurately the temperature of a device it is necessary not only to generate compact models for individual devices, which would reflect their self-heating, but also additional ones describing mutual heating effects...
This paper discusses the problem of nonlinear effects occurring in thermal modelling of electronic systems. In particular, the influence of heat transfer coefficient temperature dependence is studied based on a practical example of free convection cooled power device. The nonlinearity is identified by comparing the recorded heating and cooling curves. Additionally, the analyses are supported also...
This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device heating currents. These values are used then for...
This paper discusses on the practical example of a power diode the problem of the heat transfer coefficient dependence on temperature and its impact on device junction temperature when the thermal resistance is dominated by the heat exchange with ambient, e.g. for the free convection cooling. The proper determination of this dependence is crucial for the accurate computation of the device operating...
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