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Since high speed digital signal interconnection usually consists of differential transmission lines and pairs of via, signals passing through pairs of via need carefully handling for via can be either capacitive or inductive. The modeling of high speed via is critical to match the impedance of a pair of via and differential transmission line. Parasitic parameters of a pair of via such as capacitances...
In this paper, two kinds of transmission line, microstrip line and coplanar waveguide, with different lengths and widths are designed to study the transmission loss of different geometries. The material between the signal line and reference plane is a kind of organic substrate material which has low permittivity. Firstly, each transmission line is designed with 50 Ohm impedance to ensure little reflected...
In this paper, two kinds of transmission line, microstrip line and coplanar waveguide, with different lengths and widths are designed to study the transmission loss of different geometries. The material between the signal line and reference plane is a kind of organic substrate material which has low permittivity. Firstly, each transmission line is designed with 50 Ohm impedance to ensure little reflected...
This paper presents three related planar EBG (electromagnetic bandgap) structures based on embedded capacitors and inductors, which have small-footprints and can be used in package power or ground planes to provide wideband isolation among different parts of the power distribution network (PDN). Measurement shows −40dB isolation from 2–2.5GHz to over 10GHz. In order to improve performance at lower...
This paper presents fabrication and electrical characterization of embedded passives in organic multilayered substrates. We have designed and fabricated a test board and a functional application focusing on embedded passives. A test board with two embedded capacitor layers and one embedded resistor layer was used to evaluate capacitance and resistance performance. The functional application was used...
Optoelectronic packaging is a challenge for optoelectronic device and optoelectronic integration. In the packaging level, optical under fill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To prepare this challenge, a wide range of analysis and expertise for integrated optoelectronics,...
It causes great challenge to the ordinary method to test the performance of the die when it comes to high frequency like 40GHz, especially for the optical die with some peripheral units, which causes extra difficulties with probes on the test bench. For the discontinuity of the impendence causes great loss for high-frequency signal, and it is difficult to place the die and the optical peripheral units...
Embedded passives devices are becoming increasingly important for next generation miniaturized systems. A Printed circuit boards (PCBs) is investigated in this paper with focus on passive devices. Film resistance, capacitance and inductance are embedded into the same board. The effects of embedded capacitors and inductance on signal integrity (SI) and electromagnetic compatibility (EMC) have been...
This paper focuses on the research of optical vertical interconnect. To achieve optical vertical interconnect a new method for fiber plugging is introduced which also can be used for metal plugging. Because the pitch of both light spot of VCSEL array and sensitive surface of PD array is 250 um, and the pad pitch of VCSEL array and PD array are also 250um. So the pitch of V-Shape Groove or U -Shape...
The high-speed parallel optical transmitter module based on VCSEL/PD array, high-speed specialized integrated circuit, fiber array micro-optical components presents magnificent application and development potential. The coupling alignment between VCSEL/PD array and waveguide array has been reported using silicon optical bench (SiOB) [1–3]. In this paper, A passive coupling method based on SiOB and...
This article presents optic-electronic system on package, focus on signal integrity design optimization, and analysis method and performance verification of multi-channel two-way high-speed transceiver. Firstly the whole channel link performance is designed against all variables of interest. These variables are used to evaluate the solution at the system level. Signal integrity analysis and optimization...
This paper describes a parallel test method based on a cross-point switch which can be programmed to control signal path and the number of switches to be opened according to the number of channels to be tested. In this method, at the transmitting side, one source inputted cross-point switch can be fan-out to multi sources to activate device under test, and different signal trace or length of cables...
This paper presents an effective power noise isolation and suppression method in high-speed package substrates, which is based on planar electromagnetic bandgap (EBG) in local area of power/ground plane and embedded capacitor material between the power and ground planes. Compared with the performance of continuous power and ground planes, the proposed structure provides greater than −40dB isolation...
In this paper, we discuss the optimization of the high frequency performance of a parallel optical transceiver module, which is electrically pluggable, and its test board. A 6-layer printed circuit board (PCB) with embedded high-dielectric constant (Dk) material was built as a substrate for the optical transceiver module. An analysis of the signal integrity (SI) and power integrity (PI) is carried...
High density, large bandwidth and lower power consumption link and switch inter-system is required. Short-distance parallel optical link has become the hotspot of research because of its advantage compared with electrical link. Board communications have received a lot of attention. Most of the recent developments target 10Gbps-class systems such as super computers or high-speed IP switches. This paper...
Via design is an important factor for signal integrity. Usually there are lots of ground vias on the PCB board at high frequencies. Transmission lines need to turn or change layer, which invariably leads to impedance discontinuity and also result in the disconnection of the signal return path. To reduce the area surrounded by the signal return path and to diminish electromagnetic radiation, ground...
Differential interconnect lines in multi-gigabits system in package (SiP) packaging system are studied in this paper. The performance of interconnect lines can be easily estimated with jitter and eye opening using the eye diagram that is very helpful metric. To maintain good eye-diagram with high voltage swing and low timing jitter, a signal integrity (SI) design flow of SiP is proposed based on eye-diagram...
In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations are also introduced. Innovative diagnostics methods are described and time saving test methods are described.
This paper presents an electrical design of a 6.25Gbps×12-channel parallel optical transceiver with SiP packaging technology. Considering such high speed, a low impedance and low noise power distribution network (PDN) is designed to suppress simultaneous switching noise (SSN) and a novel embedded capacitor filter is used to replace the conventional power supply filter. To minimize the impedance discontinuity...
This paper presents a design of an optical transceiver SiP with an embedded capacitor which replace conventional filter network and suppress switching noise with a large bandwidth in multi-GHz PCBs. A SI design method was proposed based on electromagnetic analysis method and circuit analysis method. To study SI, a SPICE equivalent circuit model of the high speed I/O link was built based on transmission...
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