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This paper presents fabrication and electrical characterization of embedded passives in organic multilayered substrates. We have designed and fabricated a test board and a functional application focusing on embedded passives. A test board with two embedded capacitor layers and one embedded resistor layer was used to evaluate capacitance and resistance performance. The functional application was used...
In this paper, we will discuss the mmW performace of ribbon bonding and wire-bonding with different feature sizes and configurations on low temperature co-fired ceramics (LTCC). The impacts of the bonding wire diameter, gap, quantities, and wire loop are also the primary concern. Last but not least, this paper will give readers a comprehensive comparison of mmW performance between different interconnection...
A glass interposer with through-glass-via (TGV) is desirable for three-dimensional system-in-package (3D SiP) integration in order to implement product miniaturization, high density, high performance and integration of different functional chips with minimal signal propagation delay. Based on microwave transmission line theory and coplanar waveguide (CPW) theory, a finite element, full-wave method...
The evolution of microprocessor packaging continues to be driven by ever increasing performance, economics and different market segment requirements. CPU evolution in performance/cost is driving the packaging technology continuously. Institute of Microelectronics, Chinese Academy of Sciences has implemented the CPU packaging in 2010. The fabricated package meets all the requirements by Loongson Company,...
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