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Many large complex equipment, such as spacecraft and satellite, are typical Phased Mission Systems (PMSs). Due to sophisticated structure and complex missions, the components and systems of PMS have multiple failure modes which are correlated. On the one hand, taking multiple correlated failure modes in to consideration can describe the multistate characteristics of the system more accurately and...
This paper presents a reliability based optimization modeling approach demonstrated for the design of fine pitch ball grid array (fpBGA) structure. In this study the focus is on the strategy for handling the uncertainties in the package design inputs and their implementation into the design optimization modeling framework. The analysis of thermo-mechanical behavior of the package is carried out to...
Warpage is one of the major concerns in manufacturing BGA, CSP, POP or QFN based array packages because a reasonably flat package is critical to successful singulation and board level assembly processes. Warpage of a package is a result of curing shrinkage of encapsulated mold compounds (EMC) and CTE mismatch between various packaging materials. In a completed package, all components are bound together...
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