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Silicon based pressure sensors often take advantage of piezo-resistive gages which are normally embedded by multiple silicon oxide and silicon nitride layers where gold lines form a Wheatstone bridge. As a result of manufacturing - stepwise deposition of multiple layers - significant layer residual stresses occur in the GPa range in tension and compression. But also anodic bonding of the silicon MEMS...
In More-than-Moore technologies, the number and complexity of micro and nano devices, that are directly integrated into control units of power electronics and mechatronics systems, increase. These systems typically operate at working voltages in the range of 220–1000 VRMS [1].
We have presented an advanced FEM simulation model that is able to map the scenario of indentation of a diamond tip into a thin brittle SiNx:H film deposited on a Si substrate. Our 2D axisymmetric and 3D quarter and half models are able to reproduce all failure modes observed in preceding indentation experiments. On the one hand, brittle fracture in both film and surface were successfully modelled...
Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal migration electrical failures may occur. Loading conditions comparable to the wire bonding process can be achieved using a nanoindenter. In this work a spherical tip has been used at first to determine material properties of the silicon nitride film and also to attain cracking of the film material. Based...
The experimental observation of the actual thermo mechanical weak points in microelectronics packages remains a big challenge. Recently, a stress sensing system has been developed by the publicly funded project that allows measuring the magnitudes and the distribution of the stresses induced in the silicon dies by thermo-mechanical loads.Moisture can saturate a package very fast at high temperatures...
The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging solutions for heterogeneous electronic systems. Thermo-mechanical reliability dependent on processing and mounting steps as well as during testing are one major concern, which was addressed by FEA. The numerical...
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