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Abstract form only given. Lead, a major component in solder, has long been recognized as a health threat to human beings. One of the proposed lead-free candidates is electrically conductive adhesives (EGAs), which are composed of polymer matrix and conductive fillers. Usually epoxy and silver flakes are used as the polymer matrix and conductive fillers, respectively. Recently, Ag nanoparticles were...
Recently, non-conductive adhesive (NCA) bonding technology has attracted increasingly research interests as lead-free interconnect due to the fine pitch capability and low cost. The NCA usually requires no conductive tillers, but needs a relatively high pressure for bonding between the IC chip and the substrate coupled with heat. During bonding, the heat and pressure are applied for some time and...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests in electronic packaging industry due to the advantages of ultra fine pitch capability potential (pitch <20 mum due to the availability of micro-sized conductive particles), low processing temperatures, low stress on substrate, environmentally friendly, etc. In this study, effects of nano silver (Ag) particles...
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